Pre-Cut Geometries: Triangles, rectangles, squares, semi-circles, pentagons, and complex tailored profiles via EDM/Laser.
Product Details
1. Ultra-Dense HPHT Sintering Grid & Zero Delamination
Generic PCD blanks often suffer from premature layer delamination (the diamond separating from the carbide base) during laser-cutting or intense interrupted cutting shocks. At Uking Diamond, our blanks are processed under multi-gigapascal Ultra-High Pressure and High Temperature (HPHT) environments.
Through precise cobalt-solvent catalyst infiltration control, we achieve an absolute chemical-metallurgical bond at the interface. The diamond-to-diamond (D−D bonding) mesh grid combined with the carbide support layer guarantees excellent impact resistance, eliminating structural delamination even under high-feed continuous tooling lines.
2. Advanced Micro-Morphology for Extended Tool Lifespan
Our proprietary diamond particle grading tech eliminates uneven catalyst pooling inside the PCD matrix. This translates to an ultra-homogeneous layer featuring excellent thermal conductivity (∼500–1000 W/m⋅K).
When running high-speed CNC machinery, heat is rapidly evacuated from the critical cutting tip zone, preventing thermal graphitization of the diamond. Your factory gets stable edge retention, zero burrs on workpiece surfaces, and a massive reduction in tool change frequency compared to traditional carbide or HSS tooling.
Key Features
Flawless Cutting Edge Integrity: Superior micro-structural homogeneity allows tool manufacturers to achieve razor-sharp cutting profiles via laser or wire-EDM without micro-chipping.
Unmatched Thermal Graphitization Resistance: Superior heat dissipation capacity preserves the diamond lattice structure even under intense operational limits, enabling aggressive cutting speeds.
Highly Configurable Substrate Depth: Tailored combinations of carbide backing thickness and PCD depth to withstand specific vibration frequencies in automated milling centers.
Rigorous Non-Destructive Ultrasonic C-Scan Inspection: Every single disc is mapped via ultrasonic C-scan to ensure 100% internal bonding consistency before shipping.
Ready to Eliminate Premature Tool Failure? Secure Your Risk-Free Test Sample Today!
At Uking Diamond, we back our multi-modal sintering technology and nano-mirror finishing with 20 years of global engineering authority. We don’t expect you to take our word for it—we want you to experience the performance leap on your own production line, 100% risk-free.
Send us your engineering drawings (PDF/.DXF/.STEP) and machine parameters right now. Our technical team will review your geometric tolerances and allocate a Free Tailored Sample Batch matching your exact tensile strength and processing speed requirements.
Your inquiry has been submitted successfully. We will respond to you within 24 hours.Your message has been sent successfully. We will respond to you within 24 hours.Your inquiry has been submitted successfully. We will respond within 24 hours.