PCD Wire Drawing Dies (Polycrystalline Diamond Dies)
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Description
PCD Wire Drawing Dies (Polycrystalline Diamond Dies)
Industrial Applications
Our precision-engineered PCD dies are perfectly optimized for high-speed drafting of:
- Ultra-fine Precious Metals: Lead, Zinc, Silver, and Gold wire processing.
- Non-Ferrous Wire: Hard Alloys, Nickel, Brass, and Pure Copper wire drawing.
- High-Tensile Ferrous Metals: Stainless Steel, High Carbon Steel, and Hot Tungsten wire drawing.
Technical Specifications
| Parameter Description | Standard Control Value |
| Diameter Range | 0.04 mm – 33 mm |
| Entrance Angle | 30° ± 5° |
| Reduction Angle | 14° ± 2° |
| Bearing Length | 40% – 80% of Diameter (D) |
| Ovality Tolerance | ≤ 1 μm (Ultra-precise concentricity control) |
| Exit Angle | 50° ± 20° |
| Back Relief Angle | 15° ± 5° |
| Target Wire Material | Elongation (%) | Area Reduction (%) | Bearing Length | Reduction Angle |
| Lead, Zinc, Silver, Gold | 14% | 12.3% | 30% – 60% D | 12° ± 2° |
| Hard Alloys, Nickel, Pure Copper | 20% | 16.7% | 20% – 40% D | 14° ± 2° |
| Brass, Cu Alloys, Stainless Steel | 25% | 20.0% | 20% – 40% D | 16° ± 2° |
| High Carbon Steel | 30% | 23.1% | 30% – 60% D | 16° ± 2° |
| Hot Tungsten Wire | 35%+ | 25.9%+ | 20% – 60% D | 12° ± 2° |
Product Details
The polycrystalline diamond (PCD) wire drawing dies produced by Uking Diamond utilize top-tier raw materials, including imported premium diamond blanks such as Japanese SUMIDIA and American COMPAX (GE). This guarantees consistent structural integrity and eliminates micro-fractures under high pressure.
Our manufacturing process combines selected diamond micropowder blended with a precise metallic catalyst (cobalt). This mixture is sintered under ultra-high pressure and high-temperature (HPHT) processing conditions. Under these strictly regulated metallurgical controls, the microcrystalline particles form a robust diamond-to-diamond bond (D-D linkage). This gives our PCD dies exceptional hardness, structural isotropy, and high thermal conductivity equivalent to natural single-crystal diamonds (ND).
Because the internal diamond grains are randomly oriented, our PCD microstructures are entirely isotropic. This eliminates directional wear orientation problems, providing significantly higher structural toughness, impact resistance, and prolonged die service life compared to traditional tungsten carbide drawing dies.
Key Features
- Nano-Level Surface Polish: An ultra-fine, mirror-polished inner surface drastically improves wire surface quality, eliminates die-marks, and prevents line scratching.
- Advanced Pre-treatment Technology: Special interface treatments create a super-strong diamond adhesion matrix, preventing blank delamination even during high-impact line adjustments.
- Extended Tool Life: Exceptional abrasion resistance vastly reduces the frequency of die changes, maximizing your automated continuous drawing machine uptime.
- Ultra High-Speed Drawing: Maximizes wire throughput speeds and elevates production capacity without sacrificing cross-sectional dimensional stability.
- Simplified Coolant & Lubrication: Designed to work smoothly with standard water-based cooling media or generic drawing lubricants, ensuring minimal thermal wear and maintaining clean operating media.
Are you experiencing frequent wire breakage or surface scratching during high-speed drawing below 0.1mm?
Poor inner geometry and unstable diamond blank adhesion are the hidden killers of automated drawing efficiency, causing micro-shavings that degrade your wire finish.
At Uking Diamond, we don’t just supply dies—we design tailored solutions. Our engineering group calibrates precise reduction angles and bearing lengths based on your specific wire tensile strength (MPa) and continuous machine drawing speed.
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