Uking Diamond’s Copper Diamond (Cu/Diamond) composite materials are premier metal-matrix thermal solutions. Unlike brittle pure diamond plates, these composites can be pressed into near-net shapes or machined into complex profiles, making them highly adaptive for multi-component surface metallization and advanced brazing/soldering lines:

• High-Power Semiconductor Lasers: Serves as submounts for high-wattage laser diodes and laser bars, effectively relieving localized heat localization.
• Radar TR Modules & Electronic Countermeasures: Provides mass-producible, vibration-resistant thermal baseplates for military and commercial radar systems.
• Aerospace Thermal Management: Delivers robust, radiation-immune heat dissipation brackets for deep-space communication hardware.
• IGBT & Power Electronic Modules: Acts as the critical interface material in electric vehicles and high-voltage traction inverters to prevent severe thermal cycling fatigue.

Technical Specifications

DIMENSIONS & SURFACE FINISH

Available Forms · Plate,bar,customized shapes · Hole, slot, notch processing available · Surface metalization and bonding treatment available

Surface Finish · Front Surface Roughness: Ra < 30 nm (< 2 nm customizable) · Back Surface Roughness: 30 nm-2 μm (etchable, customizable) · Thickness:0.5-1 mm customizable · TTV: 50 μm (2 inch) customizable

Product Details

1. Engineered CTE Matching to Prevent Die Cracking

The ultimate nightmare in packaging Gallium Nitride (GaN) or GaAs chips is the CTE mismatch. Pure copper expands too fast, causing the fragile chip to crack under thermal cycles. Uking’s Copper Diamond materials solve this bottleneck.

By dispersing high-purity synthetic diamond particles inside a ductile copper matrix, we achieve a stabilized Coefficient of Thermal Expansion of 8.2 ppm/K. This sits perfectly within the thermal expansion safety window of semiconductor substrates, eliminating packaging stress and ensuring your chips survive severe on/off power cycling without delamination.

2. Near-Net Shape Fabrication & Superior Machine ability 

While pure CVD diamond plates offer unrivaled thermal metrics, they are incredibly brittle and notoriously difficult to cut or drill. Our Copper Diamond composites combine the ultra-high heat dissipation of diamond (∼1000 W/m⋅K) with the excellent machine ability of copper.

We utilize advanced powder metallurgy infiltration to create near-net shapes with complex mounting holes, steps, and counter bores. With a surface roughness of Ra<1 μm, these components are ready for direct Ni/Au or Ti/Pt/Au metallization and high-reliability eutectic brazing.

Key Features & Material Advantages

·  High Thermal Throughput: Reaches a thermal conductivity up to 1000W/m.k, instantly channeling heat away from localized semiconductor gates.

·  Tailored Low Expansion Profile: Stabilized 8.2 ppm/K thermal expansion protects fragile electronic components from mechanical fatigue during rapid thermal swings.

·  High Structural & Flexural Toughness: Flexural strength exceeding 400MPa ensures the baseplates endure harsh mechanical vibrations in automotive and aerospace installations.

·  Excellent Metallization & Soldering Adaptation: Compatible with standard PVD sputtering and plating processes, facilitating seamless wire bonding and component assembly.

Are your high-power RF modules or laser bars suffering from thermal runaway or die cracking due to poor CTE matching?

Don’t compromise electronic package reliability with uncalibrated cooling baseplates. With 20 years of MMC manufacturing experience in Henan, China, UKing Diamond delivers precision-engineered Copper Diamond heat sinks for semiconductor thermal management.

Given the precision manufacturing requirements of Cu/Diamond composites, we offer structured evaluation batches rather than unqualified free samples — ensuring every test unit meets your exact thermal and dimensional specifications.

Ready to validate Cu/Diamond thermal performance for your application? Send us your target specifications (length, width, thickness) and we will arrange a prioritized evaluation batch at factory-direct pricing — with 100% of the sample cost credited toward your first bulk order.